TSMC considering advanced chip packaging capacity in Japan | Reuters News Agency

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Technology

Reuters exclusively reported that Taiwan’s TSMC is looking at building advanced packaging capacity in Japan, a move that would add momentum to Japan’s efforts to reboot its semiconductor industry.

Market Impact

Japan is seen as well positioned to take a larger role in advanced packaging given that it has leading semiconductor materials and equipment makers, growing investment in chip fabrication capacity and a solid customer base.

Article Tags

Topics of Interest: Technology

Type: Reuters Best

Sectors: Technology

Regions: Asia

Countries: JapanTaiwan

Win Types: Exclusivity

Story Types: Exclusive / Scoop

Media Types: Text

Customer Impact: Important Regional Story

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